Materials Science and Engineering

   

Materials Research Project

Faculty

Vincent Donnelly
Vincent Donnelly
Professor of Chemical and Biomolecular Engineering
Demetre Economou
Demetre Economou
Professor and Associate Chairman of Chemical and Biomolecular Engineering
Damage-Free Nano Etching
Damage-Free Nano Etching

As dimensions continue to shrink, and as new devices with nanosize features emerge, traditional reactive ion etching results in electrical damage of sensitive devices. We have developed a new methodology that uses fast neutrals, instead of ions, to provide damage-free directional etching of nanoscale features. Fast neutrals are produced by simultaneous extraction and neutralization of plasma-generated ions through a grounded metal grid with high aspect ratio holes. Current work focuses on neutral beam characterization and etching of deep sub-50 nm features.

As device dimensions shrink to 10s of nm, film deposition and etching with monolayer accuracy must be developed. We are developing a new atomic layer etching method for damage-free etching with atomic resolution. By alternating between reactant chemisorption and “chemical sputtering” product removal steps, the required number of atomic layers of a solid are etched away, in a self-limiting process. Molecular dynamics simulations are used to guide experimentation aimed at testing the ultimate limit of feature size that may be fabricated.

Faculty

Vincent Donnelly
Vincent Donnelly
Professor of Chemical and Biomolecular Engineering
Demetre Economou
Demetre Economou
Professor and Associate Chairman of Chemical and Biomolecular Engineering